August 28, 2006
By: by Steve Janack, Director of Communications, Albany NanoTech
Albany, NY — The College of Nanoscale Science and Engineering (“CNSE”) of the University at Albany has taken delivery of the world’s first extreme ultraviolet (“EUV”) Alpha Demo Tool (“ADT”) — a $65 million tool that represents a critical step in the development and commercialization of EUV technology, which is seen as vital to the future of nanoelectronics manufacturing.
Developed by Netherlands-based ASML Holding NV (“ASML”), the leading global supplier of advanced lithography tools, the EUV ADT is the world’s first full-field EUV tool. This research and development (“R&D”) tool will be essential in development of the infrastructure for EUV lithography, considered the most likely technology to address the 32nm computer chip device node, based on cost-effectiveness and ability to extend to future nodes, according to ASML.
Once integrated into CNSE’s Albany NanoTech complex, the EUV ADT will support the R&D programs of the $600M International Venture for Nanolithography (“INVENT”), a global industry-university consortium for research and development, education and technology deployment for future generations of nanolithography applications.
INVENT was created with critical support and enabling assistance from the New York State Assembly, led by Speaker Sheldon Silver, and includes the world’s leading computer-chip manufacturers: Advanced Micro Devices (“AMD”), IBM, Micron Technology and Qimonda. Other global corporate partners of CNSE, including SONY and Toshiba, also participate in the CNSE EUV programs.
“The University at Albany’s acquisition of the world’s first Alpha Demo Tool for the advancement of nanoelectronics manufacturing is yet another step in the public/private effort to make the University and Tech Valley the nanotechnology capital of the world,” said Silver. “This is exactly the kind of achievement, the kind of progress the Assembly envisioned when we made the initial investment of five million dollars in U-Albany’s National Focus Center in Interconnects more than a decade ago. In fact, the Assembly further led the way by investing more than $100 million to establish the International Venture for Nanolithography, better known as ‘INVENT.’ The delivery of the world’s first ADT to our College of Nanoscale Science and Engineering is yet another giant step to an incredibly bright future for New York State.”
“This is another positive step in the development and expansion of the nanotechnology industry in New York State. This state-of-the-art tool demonstrates the significant progress we have made in advancing nanotechnology and the presence in our community of a very sophisticated team of scientists, technicians and faculty at the UAlbany NanoCollege. It’s very encouraging to see the Capital District Region developing into a major player in the world of high technology,” said Assembly Higher Education Committee Chair Ron Canestrari.
“Today’s announcement brings us closer to realizing our vision of INVENT, a program the Assembly established to create a topflight, world renowned high technology research center that will provide exceptional employment and economic opportunities,” said Assemblyman Jack McEneny.
“With the delivery of this tool, the College of Nanoscale Science and Engineering takes another step forward as a world leader in nanoelectronics manufacturing. The vision of so many has become a reality and our entire region and state benefit,” said Assemblyman Robert Reilly.
“The integration of the ASML EUV R&D Tool into the unparalleled facilities at the UAlbany NanoCollege will serve to advance and accelerate the research being conducted through several programs, most notably our global INVENT consortium, a vision of Speaker Silver, Assemblyman Canestrari, AssemblymanMcEneny, Assemblyman Reilly and the New York Assembly,” said Dr. Alain E. Kaloyeros, Vice President and Chief Administrative Officer of CNSE. “This R&D tool will provide superb opportunities for next-generation educational initiatives and innovative discovery in the critical area of EUV lithography, as well as a strong lure to attract additional nanoelectronics companies to locate in New York State and partner with CNSE.”
“This is a critical step in the development of EUV technology and readying it for eventual commercialization,” said Dr. James Ryan, Professor of Nanoscience and Vice President of Technology at CNSE. “With the availability of EUV photomasks and the presence of a critical mass of nanoelectronics tool suppliers and computer chip manufacturers at CNSE’s Albany NanoTech site, when coupled with ASML’s earlier demonstration of operating wafer and reticle stages in a vacuum environment, integration of an alpha exposure tool at CNSE is a logical progression in preparing both the technology and the industry for adopting the EUV technology.”
ASML has a $400 million R&D center at the New York State Center of Excellence in Nanoelectronics and Nanotechnology at CNSE’s Albany NanoTech complex — the International Multiphase Partnership for Lithography Science and Engineering (“IMPLSE”) — designed to develop nanoscale lithography technologies for future generations of nanochips. The establishment of the ASML R&D Center represents ASML’s only 300mm wafer R&D facility located outside of its main headquarters in the Netherlands.
About CNSE. The College of Nanoscale Science and Engineering of the University at Albany-State University of New York is the first college in the world devoted exclusively to the research, development and deployment of innovative nanoscience, nanoengineering, nanobioscience and nanoeconomics concepts, and in May 2006, it was ranked by Small Times magazine as the nation’s number one college for nanotechnology and microtechnology. CNSE’s Albany NanoTech complex is the most advanced research facility of its kind at any university in the world: a $3 billion, 450,000-square-foot complex that attracts corporate partners from around the world and offers students a one-of-a-kind academic experience, and it is growing. The UAlbany Nanocollege is also home to the New York State Center of Excellence in Nanoelectronics. The CNSE complex, financed through more than $500 million in governmental support and over $2.5 billion in corporate investments, houses the only pilot prototyping facilities in the academic world for the two standard sizes in computer chip design, the 200-millimeter (or 8-inch) wafer, and the 300-millimeter (or 12-inch) wafer.CNSE has more than 150 U.S. and worldwide partners, including some of the world’s largest semiconductor and semiconductor-related tool manufacturing companies. For more information, visit the CNSE Web site at http://cnse.albany.edu.