Roger R. Schmidt Distinguished Engineer, Thermal Engineering IBM
Dr. Roger R. Schmidt, Distinguished Engineer, National Academy of Engineering Member, IBM Academy of Technology Member and ASME Fellow, has over 25 years experience in engineering and engineering management in the thermal design of IBM's large scale computers. He has led development teams in cooling mainframes, client/servers, parallel processors and test equipment utilizing such cooling mediums as air, water, and refrigerants. He has published more than 75 technical papers and holds 51 patents in the area of electronic cooling. He is a member of ASME's Heat Transfer Division and an active member of the K-16 Electronic Cooling Committee. He has been an Associate Editor of the Journal of Electronic Packaging and is now associate editor of the ASHRAE Research Journal and the ASME Journal of Heat Transfer. He has taught extensively over the past 20 years Mechanical Engineering courses for prospective Professional Engineers and has given seminars on electronic cooling at a number of universities. He is Chair of the ASHRAE TC9.9 committee on Mission Critical Facilities, Technology Spaces, and Electronic Equipment.