The tools listed below can be used to process a variety of wafer sizes. Capabilities include 300mm, 200mm, 150mm, 100mm, and 75mm wafers.

Lithography and Patterning Tools:

• ASML TWINSCAN AT:1200B - 193nm ‘dry’ tool capable of 80nm imaging
  
• TEL Clean Track LITHIUS 1.5 Block 300mm coater/developer tool
  
• ASML AT:1150i - 193nm immersion, NA 0.75
  
• EV Group aligner with front to backside capability
  
• EV Group wafer bonder