E2TAC researchers have developed integrated cryogenic power modules for use in high-performance inverters. Specific areas of E2TAC R&D include:
Cryogenic qualification of packaging components and materials (substrates, die-attach, wire bonds, encapsulation)
Thermal, mechanical, and electrical modeling of power components at cryogenic temperatures
Design and prototyping of integrated power modules followed by qualification and testing
Fabrication of integrated modules for cryo-inverter demonstrations
3-D packaging development with goal to eliminate wire bonds and increase reliability
Novel Power Electronics Devices
E2TAC is using numerical simulations and proof-of-principle experimentation to investigate the potential of new high-performance device designs that are intended to provide superior I-V characteristics to current power MOSFETs or IGBTs used in power electronics.