World-Class Resources > Metrology Labs > Analytical & Characterization Techniques > FEI Dual Beam FIB/EDS

• Full 300mm wafer handling capability
• Gallium ion source
• 7 nm imaging resolution
• Omniprobe
• Pt, W metal deposition, XeF2 etching
• EBSD detector

Typical Applications: cross-sectional evaluation; TEM sample preparation; Pt, W Metal deposition; defect analysis; electrical contacts to nanoscale materials; EBSD grain mapping

Dual Beam FIB applications