World-Class Resources > Metrology Labs > Analytical & Characterization Techniques

JEOL 2010F FE-TEM
Typical applications: crystalline structure, lattice defects; thin layer metrology, process-induced defects, liners, gate oxides; novel devices, III-V materials; carbon nanotubes

JEOL 2010 STEM
Typical applications: crystalline structure, lattice defects; thin layer metrology, process-induced defects, liners, gate oxides; novel devices, III-V materials; carbon nanotubes

IonTof-V 300 TOF-SIMS
Typical applications: surface contamination analysis; depth profiling dopants and impurities; surface and 3D ion imaging

Phi 6650 Dynamic SIMS
Typical applications: dopant measurements; impurity content and distribution; elemental measurements from H to U; semiconductors, metals, dielectrics

FEI Dual Beam FIB
Typical Applications: cross-sectional evaluation; TEM sample preparation; Pt, W Metal deposition; defect analysis; electrical contacts to nanoscale materials; EBSD grain mapping

FEI-200 Single Beam FIB
Typical Applications: cross-sectional imaging; TEM sample preparation; Pt Metal deposition; defect analysis; electrical contacts to nanoscale materials

Thermo Theta Probe XPS
Typical applications: ultra thin films; surface scans – non-destructive; small area characterization; depth information using ARXPS

Phi 680 FE-AES
Typical applications: high resolution imaging, depth profiling thin films, small area depth profiles

Phi 660 AES
Typical applications: imaging surface composition; depth profiling thin films; small area depth profiling

Hitachi S-5200 SEM
Typical applications: cross-section morphology of devices; layer thickness; etch profiles and undercut; feature dimensions

Hitachi S-4800 SEM
Typical applications: cross-section morphology of devices; layer thickness; etch profiles and undercut; feature dimensions

FEI Nova-600 ESEM
Typical applications:photoresist features; lithography masks; defect characterization

Leo-1550 SEM/EDS
Typical applications: rapid imaging of samples; rapid particle or defect ID using EDS

Digital Instruments Dimension 3100 AFM
Typical applications: surface roughness; surface material properties; etch feature measurements; defect visualization

Bruker D8 DISCOVER High Resolution X-ray Diffractometer
Typical applications: XRR for thin film structure – thickness, density, roughness; high resolution diffraction analysis of bulk and thin-film single crystal materials; polycrystalline thin film powder diffraction