World-Class Resources > CNSE Wafer Processing Research & Development > Etch Services > Line/Space STI Etch Process
Line/Space STI Etch Process
Line/Space (STI)
- Hard Mask Si Etch
- 800 or 1000A RTCVD Hard Mask Nitride
- 50A Thermal Oxide
- Si Depth = 2, 3 or 4kA
