5/3/2012 6:30:00 PM
ElectroIQ: Funding the future: How best to spend limited R&D dollars?
One of the big issues now facing the industry is to how best spend limited funding for research and development, when so much needs to be done. Continued scaling to 20 nm and below, a transition to 450mm, 3D integration, device new structures, a bevy of new materials with unknown integration challenges – these are all needed.
These issues are top of mind since I’ve been asked to moderate a panel on this topic at the upcoming Advanced Semiconductor Manufacturing Conference (ASMC), to be held May 15-18 in Saratoga Springs, NY. The panel, “Competing for R&D Dollars: Funding the Future,” will be held on May 16, 2012 from 4:30-5:45.