2/9/2012 12:04:54 PM
EE Times: CNSE and partners share research results at SPIE
MANHASSET, NY -- More than 60 scientific and technical papers detail results from research by CNSE scientists and industry partners at next week's SPIE Advanced Lithography 2012 conference.
Among the research results are from collaborative programs betweeen the College of Nanoscale Science and Engineering (Albany, NY) and its industrial partners, including IBM, GlobalFoundries, Tokyo Electron Ltd., Applied Materials, Novellus Systems, ASML, Dow Electronics and Nanometrics.
Also at the event, CNSE graduate Craig Higgins will be honored with the “2011 Hiroshi Ito Memorial Best Student Paper Award in Resist Materials and Processing Technology.” His paper, “Coefficient of thermal expansion (CTE) in EUV lithography: LER and adhesion improvement,” resulted from a joint research project funded by Sematech, also a CNSE partner. Higgins received his Ph.D. in Nanoscience from CNSE last May and is now working as a principal EUV lithography engineer at GlobalFoundries.